Modifications-Archiv - flohs blog https://blog.florianehrle.de/en/category/hardware-en/hardware-modifications/ reboot tut gut Sun, 07 Jun 2026 05:51:04 +0000 en-US hourly 1 https://wordpress.org/?v=7.0 https://blog.florianehrle.de/wp-content/uploads/2025/10/cropped-icon-32x32.png Modifications-Archiv - flohs blog https://blog.florianehrle.de/en/category/hardware-en/hardware-modifications/ 32 32 Mini-PC Server #8: Cooling capacity? https://blog.florianehrle.de/en/2026/05/27/mini-pc-server-8-cooling-capacity/ https://blog.florianehrle.de/en/2026/05/27/mini-pc-server-8-cooling-capacity/#respond Wed, 27 May 2026 02:28:01 +0000 https://blog.florianehrle.de/?p=10013 Given the significantly modified third mounting point on the CPU cooler, it is unclear whether the contact pressure is sufficient to prevent thermal throttling. Since I have two […]

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Given the significantly modified third mounting point on the CPU cooler, it is unclear whether the contact pressure is sufficient to prevent thermal throttling. Since I have two identical mini-PC units, I can easily compare the modified cooler with the original one.

Using the MX-4 thermal paste initially, I tested whether thermal throttling occurred, but that was not the case. Since we still live in an attic apartment and outdoor temperatures have exceeded 30°C in recent days, the measurements were largely unusable; when the intake air is easily 5°C warmer than the day before, the results are not meaningful. The maximum values were around 84°C with Cinebench R23 running a 30-minute multicore test.

Pressure image

Unfortunately, my countersunk screw design cannot replace the original contact pressure:

It's clear that the main pressure isn't centered but offset
Close-up
Looking at it again from below
The shifted imprint pattern is also clearly visible on the cooler

It’s good to see that the pressure point isn’t centered but has shifted slightly to the right, which indicates that more pressure would be needed in the modified corner.

I’ll leave my setup as is, since the temperatures haven’t deteriorated significantly. Still, this isn’t ideal: For a 65-watt model with a more powerful cooler, this setup wouldn’t really be an option. I think I’m just barely getting away with the aluminum bracket because the CPU is so energy-efficient (35 watts).

Next, I’ll replace the thermal paste on both EliteDesk 800 G6 DM units with Honeywell PTM7950 thermal pads so I won’t have to touch the coolers for as long as possible.

Der Beitrag <h5>Mini-PC Server #8: </h5><h3><b>Cooling capacity?</b></h3> erschien zuerst auf flohs blog.

]]> https://blog.florianehrle.de/en/2026/05/27/mini-pc-server-8-cooling-capacity/feed/ 0 Mini-PC Server #7: Firmware Update for the Marvell / Aquantia AQC113 Controller https://blog.florianehrle.de/en/2026/05/26/mini-pc-server-7-firmware-update-for-the-marvell-aquantia-aqc113-controller/ https://blog.florianehrle.de/en/2026/05/26/mini-pc-server-7-firmware-update-for-the-marvell-aquantia-aqc113-controller/#respond Tue, 26 May 2026 21:01:20 +0000 https://blog.florianehrle.de/?p=10007 Now that the cooler has been modified to fit properly and I’ve confirmed via HWiNFO that extreme temperatures don’t occur – at least under light load, I turned […]

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Now that the cooler has been modified to fit properly and I’ve confirmed via HWiNFO that extreme temperatures don’t occur – at least under light load, I turned my attention to the firmware:

The Marvell/Aquantia controllers have internal firmware that can be updated. Issues are still being fixed to this day, and it’s highly recommended to flash the latest firmware version, even if that entails certain risks. The update is (only?) possible under Windows, so it makes sense for me to do this now, before Proxmox and thus Debian is running on the mini-PCs.

There are good resources for the Aquantia controllers at station-drivers.com

Update Process

I was a little worried, after all, you can easily render the module unusable if something goes wrong. It’s similar to a BIOS or UEFI update during a power outage.

That’s why I updated in two steps: first to version 1.5.38 using the official Marvell firmware updater and then a small step up to 1.5.45 using the modified updater from station-drivers.com. Both are available for download there, along with a detailed forum thread:

Download v1.5.38 (Official)
Download v1.5.45 (Mod)
Forum thread

The release notes are also interesting; there have been a lot of improvements over the years, thanks to Marvell / Aquantia:

FW version 1.5.45 for Marvell AQC113 Family of Controllers
==============================================

1.5.45
?
-------
* Updates the PCIe Gen3 x4 advertisement information.
* Tunes the PCIe memory timing for 0.7 V power supply.
* Sets hysteresis to 50 mV.
* Provides SRAM ECC protection.
* Restricts the presets to used only P4-P9.


1.5.38
27 February 2024
-------
* Bypassed automatic execution of PCIe Configuration from Bootloader.
* PCIe Serdes Firmware integrated into MAC Firmware image and loaded during cold boot.
* PCIe initialization triggered from MAC Firmware.
* ROMBIN atlantic2 set to Antigua_1_5_xxx_487


1.3.37
31 October 2023
-------
* Signed PXE ROM v3.1.106 with EFI v2.1.13 FW 
* Added fix for Pre-Boot DMA protection


1.3.36
31 October 2023
-------
* Signed PXE ROM v3.1.105 with EFI v2.1.12 FW 
* Added boot time optimization and check for cable detect status - fix for Lenovo


1.3.34
3 February 2023
-------
* Reverted the change of loading the PCIe PHY FW to PCIe PHY SRAM (Change introduced in 1.3.29).
  The PHY FW will be loaded from PCIe PHY ROM as it was before


1.3.28
8 April 2022
------------
* Added Advertize 2.5 and 5G NBase-T speed capabilities
* Added AQC113 device ID 0x34C0 to inventory list


1.3.27
18 March 2022
------------
* OEM specific release
* exluded SerDes FW to 3.5.0
* Added configuration to enable SRAM ECC detection and correction


1.3.26
23 feb 2022
------------
* OEM specific release
* Added CFG TLV configuration changes(need your input)


1.3.25
16 feb 2022
------------
* OEM specific release
*	Fixed the unintended Wake-On-Link-Up behavior on the Mac-OS environment.
* Fixed the issue of untimely wake-up from Wake-On-Timer.


1.3.24
08 feb 2022
------------
* Updated the SerDes FW to 3.5.0
* Limited the PCIe preset mask to p4-p9 for Gen3 and Gen4


1.3.23
15 jan 2022
------------
* Introduced additional provisionable PCIe configuration mode to workaround PCIe instability observed on some platforms
  Relevance- AQC113C


1.3.22
5 jan 2022
------------
* Removed default advertisement of GARP and Unsolicited NA in Sleep Proxy mode. The driver can use the new capability mask bit in the offload-control register to control this feature
* Do not wait for 20sec (linklatchuptimeout) to enable Wakeonlinkup if the link is down at the time of suspend/sleep
* Removed the extra link flap on Wake-on-link. And when the system wakes up, initialize the link at the highest possible speed
  Relevance: fast-boot mode


1.3.21
11 nov 2021
------------
* Updated PCIe VPD data
  Relevance: images with PCIe VPD support
* Added support for drvdiag -s in PCIROM v3.1.4 UEFI driver
  Relevance: UEFI


1.3.20
16 oct 2021
------------
 * OEM specific release with specific provisioning


1.3.19
-----------
* Skipped version


1.3.18
02 july 2021
------------
* Fixed the issue of incorrect packet statistics counters reported by fw
* Removed 1G half duplex speed advertisement from the speed capability configuration
* Fixed the invalid speed advertisement 
  Relevance: AQC115C-B1
* Fixed the wrong led behavior at 2.5G speed 
  Relevance: AQC115C


1.3.17
23 apr 2021
-----------
* Added firmware support to disable NCSI via BDP provisioning
* Fixed longer link downtime during os suspend to resume transition in fast-boot mode


1.3.16
13 apr 2021
-----------
* Fixed the TFTP pxe boot failure due to failure to acknowledge Ock/Oack 
  Relevance: FW images with PCIe option rom support


1.3.15
02 apr 2021
-----------
* Added mDNS support
 
 
1.3.14
-----------
* Skipped version


1.3.13
13 feb 2021
-----------
* PHY firmware updated to v6.01.02 for Bx
* PHY change: only enable autoneg timeout when downshift is enabled if downshift was active
* Disable Reed Solomon feature in PHY firmware
* Fixed AQC113 power consumption is higher when cable is removed vs. Attached


1.3.12
08 feb 2021
-----------
* Revert additional fix for mDNS


1.3.11
05 feb 2021
-----------
* Fixed answers in mDNS query differ between when system is in sleep and when the system is awake - additional fix
* Fixed panic case: extended Lom port not open up after secure request was sent


1.3.10
01 feb 2021
-----------
* Fixed AQC113 failed when configured with 10G/full-duplex and came back up with a hot-plug of cable


1.3.9
28 jan 2021
-----------
* Fixed additional fix - remove questions from response (mDNS)


1.3.8
26 jan 2021
-----------
* Fixed AQC113: link became inactive and still fails with hot-plug of cable
* Fixed additional fix for regression test failure
* Fixed AQC113: answers in mDNS query differ between when system is in sleep and when the system is awake
 
 
1.3.7
20 jan 2021
-----------
* Fixed AQC113 ping failed after stress test when system is in sleep
* Fixed [Lom] ping6 extLom is successful after the system panics without pinging basic Lom


1.3.6
10 jan 2021
-----------
* Fixed AQC113 PTP tx ring appears to stop working

	
1.3.5
6 jan 2021
----------
* Fixed AQC113 A0 : built-in became 10base after cable was plugged in switch
* Fixed [Lom] extended mode enabled before 30 sec window
* Fixed [Lom] extended Lom port should be closed after 300 seconds, not 500+ seconds
* Added provision registers 3660 and 3664 in config
* PHY firmware updated to v6.01.01 for Bx


1.3.4
18 dec 2020
-----------
* Fixed AQC113 extended Lom port should be closed after 300 seconds, not 500+ seconds - "shutdown" case
* Fixed AQC113 extended Lom port kept open after Lom unenrolled
* Fixed AQC113 ping6 ext Lom drops packets when system is shutdown (power on failed)


1.3.3
15 dec 2020
-----------
* Fixed AQC113 (both A0/B0) FW does not respond to mDNS query while sleeping
* Fixed AQC113 did not wake after tcp keepalive expires
* PHY firmware updated to v6.0.15


1.3.2
26 nov 2020
-----------
* Fixed AQC113 (both A0/B0) FW does not respond to mDNS query while sleeping (side-issue with uncast request)
* Fixed thermal shutdown functionality is not provisionable
* Remove support for 10m_HD and 100m_HD


1.3.1
09 nov 2020
-----------
* Added support for B1 devices


1.2.3
27 oct 2020
-----------
* Fixed AQC113 Lom0 doesn't generate interrupts for link change events


1.2.1
14 oct 2020
-----------
* Added support for B0 devices


1.1.27
16 sept 2020
------------
* Fixed MAC firmware hang while pc wakeup from suspend state
* Fixed unexpected wake when thunderbolt ethernet adapter is connected
* Fixed regression: ipv4 ping to nic proxy not functioning


1.1.24
22 july 2020
-------------
* Fixed configuration for GPIO
* Fixed calculation read bytes for smbus transaction of Lom
* Fixed interrupt line for Lom if rx packet available
* Fixed Lom interruption pin set to "asserted" after initializing


1.1.19
26 june 2020
-------------
* No changes


1.1.18
25 june 2020
-------------
* Fixed processing of mDNS resource records
Known issue:
* GPIO pin for reset function should be pulled up instead of pulled down


1.1.12
10 june 2020
-------------
Bug fixes:
* Fixed possible datapath stuck after hot-reset
* Fixed link negotiation issue caused after reset for AQC113C 7x7 devices
* Fixed chip stuck which may be caused by soft reset
* Fixed issue preventing chip reset when reset requested while loading ITI


1.1.5
6 may 2020
-----------
Bug fixes:
* Fixed issue that cause PCIe link drops
* Fixed issue when MAC calculated PHY hash before PHY is ready
Enhancements:
* FW provide packet to driver that woke up the system
New features:
* SNR data were added to driver interface


1.0.32
16 march 2020
-------------
Bug fixes:
* PHY reset stability improvements
* Fixed PHY FW stuck caused by fast reset
* Fixed ipv6 offload issue which may prevent receiving fragmented packets
* Fixed VPD corruption caused by multiple VPD read/write operations
Enhancements:
* Hot reset alarm support added
* MSM settings may be applied without link drop-off


1.0.25
14 february 2020
-------------
Bug fixes:
* FW no longer wake host after first link down/up immediately after hibernation
* Fixed SerDes initialization which cause disappearance from PCIe
* Fixed wake on link up
Changes:
* Disabled half-duplex by default for 10M, 100M, 1G speeds


1.0.22
31 january 2020
-------------
Enhancements:
* Disabled half duplex on 10M, 100M, 1G speeds by default
Changes:
* Disabled run-time power optimizations


1.0.19
24 january 2020
-------------
Enhancements:
* Added "coma" power mode
Bug fixes:
* Fixed disappearing from PCI after hibernating
* Fixed data at mDNS response for ipv4 "A" request
* Fixed missing response for mDNS PTR+TXT request
* Fixed chip licensing, which hadn't got settings from efuse high word


1.0.13
10 january 2020
-------------
Enhancements:
* Reduced minimal timeout for TCPKA from 60 to 1 sec
Bug fixes:
* Fixed link up in sleep proxy mode
* Fixed missed ipv6 probes after TCPKA timeout
* Fixed wake up caused by receiving TCPKA probe with wrong flags
* Fixed data at mDNS reply


1.0.11
30 december 2019
-------------
New features:
* Added chip licensing functionality
* Added thermal monitor interface
* Added cable diagnostics
Bug fixes:
* Fixed flow control configuration. Incoming pause frames cause traffic slow down as intended.
* Fixed forced reset of PHY FW caused by MAC FW
* Fixed incorrect data at probe packet which is generated by TCPKA offload
* Fixed invalid src ipv6 at mDNS reply
* VPD mailbox was removed from FW
* Fixed wake up counter
* Fixed resending probes by TCPKA after receiving correct ack on first probe


1.0.3
20 december 2019
-------------
Initial release

Perform the first update

The requirements should be:

  • Secure Boot must be disabled in UEFI
  • Everything in Windows Defender must be turned off (including the “Driver Block List”)
  • Other antivirus software must also be disabled

To update to version 1.5.38, simply download the archive linked above, extract it and run the “startprg.bat” file it contains as an administrator. Once the process is complete, the command prompt windows that opened will close automatically, and you should restart your PC.

Using “kickstart2.exe” you can check before or after the update to see which firmware is currently running on the controller:

Version 1.5.38 has been successfully flashed

Script modifications

To update to version 1.5.45, you need to make changes to the script provided by station-drivers.com, as the IDs listed there are incorrect:

For the modified updater to work with this HP FlexIO v2 module, the four ID blocks must be adjusted to match those of the module. Actually, only two of them need to be changed. To do this, in the “Check if device matches required IDs” section of the “flashUpdateScript.ps1” script file, enter the following:

    # Configuration 1 and 2
    If (($ids[1] -eq "0x1D6A") -and ($ids[3] -eq "0x1043") -and ($ids[4] -eq "0x8890")) {
        If (($ids[2] -eq "0x04C0") -or ($ids[2] -eq "0x14C0")) {
            $deviceSupported = $true
        }
    }

by replacing it with:

    # Configuration 1 and 2
    If (($ids[1] -eq "0x1D6A") -and ($ids[3] -eq "0x103C") -and ($ids[4] -eq "0x88FB")) {
        If (($ids[2] -eq "0x04C0") -or ($ids[2] -eq "0x14C0")) {
            $deviceSupported = $true
        }
    }

It’s best to cross-check the IDs with the hardware IDs in Device Manager; they must match. Then save the script, close it, and run the “startprg.bat” file, which is also included.

Perform the update to version 1.5.45

The first thing I noticed was a message saying that the installed driver (from Windows Update) was too old. Once I updated it by installing the newer v3.1.11 version from the Marvell website, the update went through without any problems:

After restarting the PC, everything is working as it should. That was a nerve-wracking process – all that tinkering beforehand would have been for nothing if the update had gone wrong. Now the controller is ready for the future on Debian / Proxmox VE.

Der Beitrag <h5>Mini-PC Server #7: </h5><h3><b>Firmware Update for the Marvell / Aquantia AQC113 Controller</b></h3> erschien zuerst auf flohs blog.

]]> https://blog.florianehrle.de/en/2026/05/26/mini-pc-server-7-firmware-update-for-the-marvell-aquantia-aqc113-controller/feed/ 0 Mini-PC Server #6: Can’t be done? No way! https://blog.florianehrle.de/en/2026/05/26/mini-pc-server-6-cant-be-done-no-way/ https://blog.florianehrle.de/en/2026/05/26/mini-pc-server-6-cant-be-done-no-way/#respond Tue, 26 May 2026 19:42:07 +0000 https://blog.florianehrle.de/?p=10001 First and foremost, I had to make sure that the module actually worked, both electrically and in terms of software. I’ve read in several places online that there […]

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First and foremost, I had to make sure that the module actually worked, both electrically and in terms of software. I’ve read in several places online that there are indeed models (e.g. the ProDesk series) where the module physically fits but doesn’t work on the UEFI side because the necessary drivers don’t seem to be integrated there. To address this, I temporarily replaced the CPU cooler with an old Intel cooler, with some thermal paste in between. This allows the module to fit:

Short-term test operation with a passive heat sink
The module fits...
...but it covers the mounting point.

When offline, the network adapter is recognized as such, and Windows automatically installs the appropriate driver once an Internet connection is established. However, the module should also be recognized and function properly with the driver directly from Marvell; moreover, the driver version from Marvell is always more recent (Marvell Public Drivers -> Windows -> AQC113):

Download the drivers from Marvell

Device Manager

Once everything has been installed correctly, you can check in Device Manager to see if everything has been configured or recognized as expected:

You can also learn a lot about the module using HWiNFO:

HWiNFO

The module is connected internally via the FlexIO v2’s proprietary slot using two PCI Express 3.0 lanes, which should easily support the full 10 Gbps (one PCIe 3.0 lane theoretically provides 8 GT/s, so two lanes provide 16 GT/s. This theoretically corresponds to 1.969 GB/s, whereas 10 GbE can transfer a maximum of approximately 1.25 GB/s).

In summary, it appears that everything is functioning properly at the electrical and software levels. It is therefore truly “only” a mechanical issue that prevents the revised, newer module from fitting into the Mini PCs. A completely baffling decision on HP’s part.

Mechanical adjustments

On closer inspection, it should be possible to adapt the mounting point. Ideally, this would be a CNC-machined part that incorporates the factory-installed spring pressure beneath the screw to ensure the cooler continues to apply the necessary contact pressure to the CPU. However, I wanted to resolve the issue practically and quickly, so I built an adapter out of an aluminum angle profile, right on the actual component.

First, the cooler needs to be made mountable at all; to do this, I first took stock of what was possible:

The cooler cannot be placed
Top view
Side view
Close-up side view
3–4 mm gap

The third bolt connection has to go; unfortunately, there’s no way around it. There isn’t much room, but at least there’s some.

Cooler modification

First, I removed the thermal pads to prevent metal shavings from getting inside them. Next, I unscrewed the tinplate cover of the cooler (PH0) to see what the inside looked like. Then I modified the “corner” to fit:

Cooler viewed from above
Cooler from below
Thermal pads removed
Metal lid removed
The fastener must be removed
The screw was removed by pushing out the retaining ring
Marked what needs to go
Cut with a small metal hand saw
Remaining portion broken off
Filed to form

Now, at least, the cooler and the network module can be placed in the right spot:

It almost looks like it was done on purpose

Build a mount

I used a leftover piece of an aluminum angle profile and modified it accordingly. I had a suitable screw with the “UNC 6#-32” inch thread – which is (unfortunately) common in the IT sector – in my parts stash. This is the same thread used, for example, on the side mounting holes of 3.5-inch hard drives:

Raw materials
Filed
Smoothed and drilled
Other side

To determine the position of the second hole for mounting the cooler, I temporarily screwed the component into the mini PC. On the underside, where the bracket touches the circuit board, I used PVC electrical tape to provide insulation and protection:

Test assembly
Screw range determined
Second hole drilled and countersunk
Location of the M3 thread determined
Thread has been cut

The Torx screw facing the cooler is an M3 stainless steel countersunk screw, designed to apply at least some pressure to the processor via the countersunk head. I felt that securing it using the slotted hole in the bracket and a pan-head screw was too “unreliable” – if it slips, nothing will hold it in place. I also filed down the UNC screw at the original mounting point, since the ill-fitting module directly above the screw is unfortunately also full of components from below:

HP 56Q71AA Modul Rev. 2 - Port
HP 56Q71AA Modul Rev. 2 - Top view
HP 56Q71AA Modul Rev. 2 - Bottom view
HP 56Q71AA Modul Rev. 2 - The underside is also richly decorated

Now I was able to put everything back together and run some initial tests. I used Arctic MX-4 as the thermal interface material to check whether the modification actually works or if the cooler fits so poorly that I need to build a second, more stable version. I applied a layer of white PVC electrical tape to the filed-down screw head, just as I did on the underside of the bracket; a standard sheet of printer paper fits just barely between the SMD components and the PVC. It works, but it’s still very tight:

The screw head should also be insulated
Ready to assemble
Thermal pads repositioned
Seems like a good fit
Almost as if on purpose

Now we need to determine whether the cooling capacity is still sufficient so that we can then update the network controller’s firmware first.

Der Beitrag <h5>Mini-PC Server #6: </h5><h3><b>Can’t be done? No way!</b></h3> erschien zuerst auf flohs blog.

]]> https://blog.florianehrle.de/en/2026/05/26/mini-pc-server-6-cant-be-done-no-way/feed/ 0 External 3.5″ hard drives from WD and their deliberate incompatibilities https://blog.florianehrle.de/en/2025/12/14/external-3-5-hard-drives-from-wd-and-their-deliberate-incompatibilities/ https://blog.florianehrle.de/en/2025/12/14/external-3-5-hard-drives-from-wd-and-their-deliberate-incompatibilities/#respond Sun, 14 Dec 2025 03:46:00 +0000 https://blog.florianehrle.de/?p=7402 There used to be many hard drive manufacturers, but today there are only a few. Three have survived the flood of solid state drives, which are generally better […]

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There used to be many hard drive manufacturers, but today there are only a few. Three have survived the flood of solid state drives, which are generally better from a technical standpoint: Western Digital (including the formerly independent manufacturer HGST), Seagate, and Toshiba. My favorites have always been WD and HGST, as these manufacturers have proven to be durable and generally reliable. I have never used Toshiba extensively in the 3.5″ range and therefore have little experience with them. I have had some bad experiences with Seagate, so I avoid products from this company.

In one area, hard drives remain unbeatable compared to SSDs: € per TB of storage capacity. This ratio can and could be improved even further by purchasing external hard drives and “shucking” them—that is, removing the internal 3.5″ standard drive with SATA interface from the respective manufacturer and using it elsewhere, for example in a NAS or storage server. Depending on the purchase price, this is a relatively inexpensive way to obtain new hard drives with large capacities.

The disadvantage is that in the event of a defect, the warranty may not be honored, and external hard drives generally have rather short warranty periods. Almost always, “lower-end” or inferior model variants of retail versions are now installed, often with special, slowing firmware (“white label”).

Nevertheless, the price difference compared to a single hard drive has been so high in some cases, especially in recent years, that it has been possible to overlook this.

What always remains?

Everything except the hard drive itself. So the enclosure, the circuit board to convert SATA to USB, and the 12-volt power supply. If you’ve “shucked” a few hard drives, you’ll accumulate quite a bit over time. I’ve collected various models of external hard drives from WD, 13 enclosures in total.

One day, I wanted to reuse one of these enclosures by installing a 6 TB hard drive from HGST*. If you’ve taken these enclosures apart a few times, reassembling them is a breeze. After connecting it to power and a computer, I was disappointed to find that the hard drive wasn’t recognized!

3.5" hard drive from HGST with 6 TB capacity (helium)
The hard drive logs into the system as expected as “WD MyBook 1230.”
First surprise: Windows Disk Management wants to initialize the hard drive, but I already initialized it as GPT in an HDD dock.
Initialization fails.
Windows cannot access the hard disk.
MiniTool Partition Wizard also does not want to initialize or format the hard drive.

What?!

Yes, seriously. Western Digital has ensured that the actually quite generic controller boards in these enclosures only work with Western Digital hard drives. Especially since HGST has been part of WD for quite some time, not even that works. I tried installing a WD Blue – it worked right away.

After a frustrating search, I found posts from other users who were just as frustrated. But there was light at the end of the tunnel: there are models that work with everything out of the box, then there are those that require a small modification to work, and those that allow you to flash different, open firmware.

And that’s what this post is about – how to ensure that the controller accepts all hard drives. I can speak for three types of external WD hard drive enclosures.

First, the problem I stumbled upon:

The enclosure was from a 4 TB hard drive, type WD MyBook* – model number “WDBFJK0040HBK-04.” Purchased around 2015, refurbished. After doing some research, I was optimistic that I would be able to make full use of this enclosure.

Western Digital used an ASM1051W from ASMedia (an ASUS subsidiary) as the controller, apparently with a data connection to an external SPI chip from Winbond.

WD MyBook, model variant from around 2013.⧉ WD
My specific model
Controller from ASMedia

Hobbyists have discovered that if the controller cannot communicate with the SPI flash, it behaves like any other generic ASMedia chip as a fallback. Jackpot.

There is little to lose, so what needs to be done?
Simply cut the connection to the rest of the board at pins 1 and 2 of the Winbond SPI chip. To do this, I carefully cut through the two pins from the side with a pair of electronics side cutters and then used the blade of a utility knife to gently lift the now-separated contacts until I could see a gap with the naked eye. Theoretically, pin 1 would have been sufficient, but this way is safer.

Electronics side cutters and small utility knife
These pins are meant
Pins cut through

Then I put everything back together again and lo and behold:

The hard drive now logs into the system as “AS2105.”
In MiniTool Partition Wizard, the disk is no longer “bad”...
...and can be easily initialized, partitioned, and/or formatted!
The disk management tool can also suddenly see the disk.
CrystalDiskMark of the HDD in the WD MyBook enclosure
CrystalDiskMark of the HDD in an Orico dock via USB 3.0 for comparison

Success. I then ran tests with a Seagate and a Toshiba hard drive, and everything works. I then modified the remaining three cases of this type that I own.

The model that runs by default

There are obviously several revisions of the controller boards in the various models. Next, I disassembled the housing of a WD Elements with the model number “WDBWLG0080HBK-0B” that used to have 8 TB. The controller installed there was a JMicron JMS579 with SPI flash from Winbond. This combination can be problematic or unproblematic. In this model, the hard drive from HGST ran without any modifications.

WD Elements with 8 TB⧉ WD
Model
Circuit board with JMS579 controller and other components

However, there are reports that some versions with this controller do not work. If this specific controller is installed and only WD hard drives are recognized, flashing open firmware should remedy the problem.

JMS579 – Flash firmware

First, I came across this post:

From there, I continued to search until I found a “turnkey solution.” This originally came from a Chinese forum in Chinese and was translated into English by a helpful user.

This archive contains everything you need to reflash a WD enclosure with this controller (the English tutorial is also included as a PDF):
Download at Mediafire
Download at Archive.org

Conclusion

It is truly incomprehensible why the hardware is deliberately turned into potential electronic waste. There must be limits somewhere, and I cannot imagine that Western Digital’s public image is positively influenced in any way by such a design.

I was able to make all of the non-functioning enclosures in my possession workable by flashing the firmware or modifying the SPI flash.

Unfortunately, there are also reports of newer revisions for which there seems to be no solution at the moment. The WD MyBook Duo* enclosures generally do not appear to be modifiable. It’s a shame, as I own several of them – still in operation with WD hard drives.

Der Beitrag External 3.5″ hard drives from WD and their deliberate incompatibilities erschien zuerst auf flohs blog.

]]> https://blog.florianehrle.de/en/2025/12/14/external-3-5-hard-drives-from-wd-and-their-deliberate-incompatibilities/feed/ 0 i7-7700K OC #3: Dangerous things first https://blog.florianehrle.de/en/2025/02/08/i7-7700k-oc-3-dangerous-things-first/ https://blog.florianehrle.de/en/2025/02/08/i7-7700k-oc-3-dangerous-things-first/#respond Sat, 08 Feb 2025 15:52:00 +0000 https://blog.florianehrle.de/?p=7802 I consider delidding the processor to be one of the most important steps in this project.EKWB describes the whole process well: EKWB (archive.org) Firstly, you generally achieve much […]

Der Beitrag <h5>i7-7700K OC #3: </h5><h3><b>Dangerous things first</b></h3> erschien zuerst auf flohs blog.

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I consider delidding the processor to be one of the most important steps in this project.
EKWB describes the whole process well: EKWB (archive.org)

Firstly, you generally achieve much lower temperatures even with original clock speeds, and secondly, this greatly increases the scope for overclocking. At the same time, power consumption is reduced and the cooling system has to work less hard.

In my situation, it makes sense to do this first—before purchasing other necessary hardware. There is always the risk that the CPU will be irreparably damaged during delidding and the whole project will go down the drain, so it’s better not to buy anything that you won’t be able to reuse later.

What is required?

There are several different delidding tools available from various suppliers to minimize the risk of damage. I printed a tool myself and also ordered a very inexpensive one from China*, and ultimately used the Chinese one (die-cast aluminum, more stable than PLA). To securely but reversibly and heat-resistantly reattach the heat spreader after delidding, I used “Dirko HT*” from Elring, which is very well known in the automotive industry. I used this 3D-printed mold to press the parts together.

Ultimately, the inferior thermal paste used by Intel ex works should be replaced with something much more efficient. Liquid metal* is really the only option if you want to get the most out of it:

Liquid metal from the market leader⧉ Thermal Grizzly
Elring Dirko HT⧉ Elring
Delidding tool from China

This will also be my first project using liquid metal, which has interested me for a long time—there just hasn’t been a really useful application for it until now, and it’s not exactly cheap. That’s about to change.

Let’s go…

First of all, it should be noted that you should proceed with extreme caution, as there are many small, sensitive SMD components on the underside of the CPU that could potentially be damaged.

With the necessary care, place the processor in the delid tool and screw it in by hand until the movable part slightly clamps the heat spreader. At this point, you should check carefully that the CPU is inserted correctly (the right way round!) and has enough space around it, then insert the Allen key provided into the screw head and continue screwing the screw into the tool. It should be difficult at first and then suddenly easy. When this point is reached, unscrew the screw, remove the slider again, and remove the CPU.

Don’t keep screwing when it got easier!

If you now carefully press between the heat spreader and the circuit board with your fingernails or a plastic spatula, the heat spreader should be easy to remove.

You can see the SMD components that “protrude”⧉ bit-tech
The CPU is carefully inserted into the tool (image for illustration purposes only, different CPU)
The i7-7700K is now delidded⧉ TechPowerUp

Cleaning:

Now everything should be cleaned thoroughly. The black adhesive used by Intel, which is probably silicone-based, is stubborn. It is best to scrape it off the heat spreader with a plastic or wooden object. Of course, you should use something that is softer than nickel-plated copper (the material the heat spreader is made of) to avoid scratches or similar damage.

On the circuit board side, you have to do the same thing, but with extra care.
I scraped it off very carefully with my fingernails and “rubbed off” the remaining residue with isopropanol on a paper towel.

The thermal paste can be removed as usual with isopropanol*, nothing special.
If the result looks like this, everything has gone well:

Everything is perfectly clean, just as it should be⧉ PCGH

Isolation:

Now the processor must be prepared for use with liquid metal. This means that all potentially conductive surfaces must be insulated, either with (nail) polish* or Kapton tape*.

I found polish to be safer and therefore coated all marked surfaces with nail polish:

Contact surfaces that should be insulated (marked in blue and green)

In retrospect, I would say that insulating the four contacts (marked in green) near the die with Kapton would have been sufficient. Since this was my first project with liquid metal, I proceeded with excessive caution.

Applying liquid metal:

Now comes the actual application of the liquid metal.
It is supplied in a syringe, together with cloths and a kind of special “cotton swab.”
First, the processor is placed on a soft, flat surface and a small “ball” of liquid metal is applied to the center.

This is then spread over the die with the cotton swab using circular movements and a little pressure until it is evenly distributed.

I then spread a really thin line of Elring Dirko HT sealant over the heat spreader.

For illustration purposes, this is a GPU. However, the principle remains the same⧉ Phiarc
i7-7700K coated with liquid metal – this is how it should look⧉ TechPowerUp
I left some space at the top in the middle so that air can flow in and out—after all, the whole thing is under a lot of thermal stress, and Intel also left an opening at the factory

Assembling the CPU:

Now you can reassemble the CPU. I used the 3D-printed tool linked above for this. I used it as intended, but in addition to the clamp, I pressed the whole thing a little more in a small vise* than the clamp was able to do. In principle, however, many things work, even a small vise with rubber protectors should do the trick.

The whole thing has to be pressed together with force over a longer period of time so that the adhesive layer dries as thinly as possible to achieve a minimal gap between the heat spreader and the circuit board.

The crazy folks at TechPowerUp even tested this with superglue*, which hurts (irreversibly!).

The whole thing should now be set aside for a few hours to dry, rather than too little time.

Did the CPU survive?

At that point, I only had Gigabyte’s significantly undersized B250M motherboard with the appropriate 1511 socket at hand. So I had to use it again for testing, and lo and behold:

The processor is still running. Perfect.

I then aligned a 120mm fan* with the VRMs on the motherboard and let it blow at full speed while the CPU was “burned in” for hours with Prime95 Small FFTs with AVX and AVX2.
As usual, I used MX-4 from Arctic* as thermal paste between the heat spreader and the cooler.

Of course, despite the fan, the motherboard throttled the processor down to below the base clock every 10 minutes after about half an hour, but I now knew what I wanted to find out:
The processor runs stably and, even with the reused, similarly undersized Alpenföhn Sella, is easily 20 °C cooler than before. Even under these very unfavorable circumstances, there is no longer any thermal throttling of the CPU!

I read this several times during my research; temperature reductions of 10 to 30 °C (when overclocking) are supposed to be possible. But seeing it live was something else entirely—I had never seen such an extreme improvement before and have never seen it again since, and since more modern processors inherently reach their thermal and performance limits, I probably never will again.

What are you doing, Intel?

The real insight is that Intel (intentionally?) used cheaper thermal paste instead of more expensive indium solder in production to either limit these CPUs or to achieve the effect over time that they become hotter and slower because the thermal paste dries out and will probably even lose contact between the die and heat spreader in some cases. Since “Ivy Bridge,” thermal paste has been used instead of solder, up to and including “Kaby Lake,” the generation from which this i7-7700K also originates.

The FAT and SLIM models of Sony’s Playstation 3 were technically given a best-before date in the same way (thermal paste between the heat spreader and die on the CPU and GPU). The Super Slim is then Direct-Die, presumably for space reasons.

This project was a complete success, and now suitable hardware is being sought to adequately overclock this CPU.

Der Beitrag <h5>i7-7700K OC #3: </h5><h3><b>Dangerous things first</b></h3> erschien zuerst auf flohs blog.

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