Setup:

Proxmox Low Power Server

Veröffentlicht am Published on 发表于 28. May 2026 um at , 22:14

Here is a complete list of the Proxmox servers currently running continuously in our environment. Not included in this list is the TR server, which has been taken offline for the time being due to components being removed for reuse, and the Proxmox Backup Server, which continues to be used automatically as a backup destination by all VM servers.

The configurations for these two (TR server and PBS) are detailed in this post.

Hardware:

HostnameServer-PVE-MonitoringServer-PVE-ServicesServer-PVE-MediaServer-PVE-Streaming
Main purposeMonitoringServicesMediaStreaming
Usage profile24/724/724/724/7
BaseDell Latitude E5270 (2016)
Subnotebook
HP 17-by2132ng (2019)
Notebook
HP EliteDesk 800 G6 DM (2020)
Mini Desktop PC
HP EliteDesk 800 G6 DM (2020)
Mini Desktop PC
ProcessorIntel Core i5-6300U (SR2F0)
Skylake → U (14 nm)
Stepping D1

2 Cores, 4 Threads
Base clock 2.40 GHz

Caches:
L1 : 128 KB
L2: 512 KB
L3: 3 MB

15 Watts TDP
Intel Core i5-10210U (SRGKZ)
Comet Lake → U (14 nm)
Stepping V0

4 Cores, 8 Threads
Base clock 1.60 GHz

Caches:
L1 : 256 KB
L2: 1 MB
L3: 6 MB

15 Watts TDP
Intel Core i5-10500T (SRH3B)
Comet Lake → T (14 nm)
Stepping G1

6 Cores, 12 Threads
Base clock 2.30 GHz

Caches:
L1 : 384 KB
L2: 1.5 MB
L3: 12 MB

35 Watts TDP
Intel Core i5-10500T (SRH3B)
Comet Lake → T (14 nm)
Stepping G1

6 Cores, 12 Threads
Base clock 2.30 GHz

Caches:
L1 : 384 KB
L2: 1.5 MB
L3: 12 MB

35 Watts TDP
SocketNone, processor is soldered
FC-BGA, 1356 Contacts
None, processor is soldered
FC-BGA, 1528 Contacts
FC-LGA, 1200 ContactsFC-LGA, 1200 Contacts
CoolingAir, Dell OEM
Copper heat pipes and aluminum
Air, HP OEM
Copper heat pipes and aluminum
Air, HP OEM
Copper plate in aluminum
Air, HP OEM
Copper plate in aluminum
MainboardDell OEM
Latitude E5270
HP OEM
17-by2132ng
HP OEM
EliteDesk 800 G6 DM
HP OEM
EliteDesk 800 G6 DM
ChipsetIntel Sunrise Point LP
PCH-On-Package (14 nm)

Sits on the CPU
< 2 Watts TDP
Intel Comet Lake LP
PCH-On-Package (14 nm)

Sits on the CPU
< 2 Watts TDP
Intel Q470
Comet Lake (14 nm)

Passive cooled
6 Watts TDP
Intel Q470
Comet Lake (14 nm)

Passive cooled
6 Watts TDP
Memory16 GB Samsung (2 x 8 GB)
DDR4-2133 (1.2 Volts)
Dual-Channel

SO-DIMM (Unbuffered)
2 of 2 Slots used
24 GB Samsung (1 x 16 GB, 1 x 8 GB)
DDR4-3200 @ 2666 (1.2 Volts)
Dual-Channel

SO-DIMM (Unbuffered)
2 of 2 Slots used
32 GB Samsung (2 x 16 GB)
DDR4-3200 @ 2666 (1.2 Volts)
Dual-Channel

SO-DIMM (Unbuffered)
2 of 2 Slots used
64 GB Mushkin Redline (2 x 32 GB)
DDR4-2666 (1.2 Volts)
Dual-Channel

SO-DIMM (Unbuffered)
2 of 2 Slots used
GraphicsPassthrough:
Intel HD Graphics 520
Generation 9 – GT2
Passthrough:
Intel UHD Graphics 620
Generation 9.5 – GT2
Passthrough:
Intel UHD Graphics 630
Generation 9.5 – GT2
Passthrough:
Intel UHD Graphics 630
Generation 9.5 – GT2
Boot deviceSSD Samsung SM863a (480 GB)
MZ7KM480HMHQ-000FU
512 MB DRAM-Cache
SATA-III
2.5″
SSD Samsung SM863a (480 GB)
MZ7KM480HMHQ-000FU
512 MB DRAM-Cache
SATA-III
2.5″
SSD Samsung 870 Evo (2 TB)
2 GB LPDDR4-1866 DRAM-Cache
SATA-III
2.5″
SSD Samsung 870 Evo (4 TB)
4 GB LPDDR4-1866 DRAM-Cache
SATA-III
2.5″
Storage devices
NVMe – SSD
SSD Samsung 970 Evo Plus (500 GB)
512 MB LPDDR4-1866 DRAM-Cache
Passive cooled (JEYI)
NVMe, PCIe 3.0 x4
M.2, 2280
SSD Samsung 970 Evo Plus (1 TB)
1 GB LPDDR4-1866 DRAM-Cache
Passive cooled (JEYI)
NVMe, PCIe 3.0 x4
M.2, 2280
SSD Samsung 970 Evo Plus (2 TB)
2 GB LPDDR4-1866 DRAM-Cache
Passive cooled (Homemade)
NVMe, PCIe 3.0 x4
M.2, 2280

Mega Fastro MS200 (2 TB)
1 GB DDR4 DRAM-Cache
Passive cooled (Homemade)
NVMe, PCIe 3.0 x4
M.2, 2280
SSD Samsung 970 Evo Plus (2 TB)
2 GB LPDDR4-1866 DRAM-Cache
Passive cooled (Homemade)
NVMe, PCIe 3.0 x4
M.2, 2280

Mega Fastro MS200 (2 TB)
1 GB DDR4 DRAM-Cache
Passive cooled (Homemade)
NVMe, PCIe 3.0 x4
M.2, 2280
Storage devices
SATA – SSD
SSD Samsung SM863a (480 GB)
MZ7KM480HMHQ-000FU
512 MB DRAM-Cache
SATA-III
2.5″
Network1 Gbit Ethernet, RJ-45
Intel I219-LM (PCIe, integrated)
1 Gbit Ethernet, RJ-45
Realtek RTL8168 (PCIe, integrated)
1 Gbit Ethernet, RJ-45
Intel I219-LM (PCIe, integrated)
1 Gbit Ethernet, RJ-45
Intel I219-LM (PCIe, integrated)

10 Gbit Ethernet, RJ-45
Marvell / Aquantia AQC113 (PCIe 3.0 x2, FlexIO v2 Module)
Power supplyDell 19.5 V (Round)
65 Watts max. (3.34 A)
HP 19.5 V (Round)
45 Watts max. (2.31 A)
HP 19.5 V (Round)
65 Watts max. (3.33 A)
HP 19.5 V (Round)
65 Watts max. (3.33 A)
CaseOEMOEMOEMOEM
Miscellaneous“Headless”“Headless”An additional RS-232 port is installed but not in use

Firmware:

ManufacturerCustom DellInsydeCustom HPCustom HP
TypeUEFI
128 Mb ROM (16 MB)
UEFI
96 Mb ROM (12 MB)
UEFI
128 Mb ROM (16 MB)
UEFI
128 Mb ROM (16 MB)
Version1.34.3
20.11.2022
F.69
21.04.2023
S21 – 02.25.00
12.01.2026
S21 – 02.25.00
12.01.2026

Software:

Operating systemx64 Proxmox VE
Always up to date, German
x64 Proxmox VE
Always up to date, German
x64 Proxmox VE
Always up to date, German
x64 Proxmox VE
Always up to date, German
Type of BootUEFI with Secure BootUEFI with Secure BootUEFI with Secure BootUEFI with Secure Boot
Partition tableGUID Partition TableGUID Partition TableGUID Partition TableGUID Partition Table

Screenshots:

Documents / Drivers

Server-PVE-Monitoring Drivers at Dell
Server-PVE-Services Drivers at HP
Server-PVE-Media and Server-PVE-Streaming Drivers at HP


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